/resources/image/template/step.png Inspection & Testing

Inspection & Testing

GETO offers in-circuit and functional testing of electronic assemblies. Our Test Engineering Department is staffed by electrical engineers and technicians with years of experience building test equipment and developing effective test methodologies. We can utilize your existing test fixtures or design them ourselves. Either way, we will make sure that your finished product will meet or exceed your quality and performance requirements.

Automatic Optical Inspection (AOI)

AOI machine equipped with repair station for SMT components inspection.

Automatic Optical Inspection (AOI) is an automated visual inspection of a wide range of products, such as Printed circuit boards (PCBs), LCDs, transistors, automotive parts, lids and labels on product packages or agricultural products (seed corn or fruits). In case of PCB-inspection, a camera autonomously scans the Device Under Test (DUT) for variety of surface feature defects such as scratches and stains, open circuits, short circuits, thinning of the solder as well as missing components, incorrect components, and incorrectly placed components.

Flying probe (ICT) test systems are used for testing basic production, prototypes, and boards that present accessibility problems. Flying probe testing uses electro-mechanically controlled probes to access components on Printed Circuit Assemblies (PCAs). Commonly used for test of analog components, analog signature analysis, and short / open circuits.

They can be classified as

  • in-circuit test (ICT) systems or as
  • Manufacturing Defects Analyzers (MDA).

They provide an alternative to the bed-of-nails technique for contacting the components on printed circuit boards. The precision movement can probe points on PLCCs, SOICs, PGAs, SSOPs, QFPs and others, without any expensive fixturing or programming required.

In-circuit test (ICT) is a testing where, an electrical probe tests a populated printed circuit board (PCB), checking for shorts, opens, resistance, capacitance, and other basic quantities which will show whether the assembly was correctly fabricated. It may be performed with a bed of nails type test fixture and specialist test equipment, or with a fixtureless in-circuit test setup.

X-Ray system provides the highest level of quality inspection for process and board analysis. While X-ray inspection is essential for verifying the quality of BGA (Ball Grid Array) components, it is also useful for analysis of standard IC packages and connectors. With x-ray inspection, our engineers can look through the board and components associated with hidden failures to identify and solve problems that would be impossible to find through visual inspection alone. In many cases we're able to remove defects during the manufacturing process and avoid the expensive performance problems that they might cause. We save all our x-ray inspection images in digital form for future references and to verify manufacturability.

Visual (Manual) Inspection

Visual inspection for THT components according IPC standards from well trained personnel.

Successful Test Strategy



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