/resources/image/template/step.png Solder Paste

Solder Paste

Solder Paste is a material used in the manufacture of printed circuit boards to connect surface mount components to the copper traces of the board. The paste initially adheres components in place by being sticky, it is then heated (along with the rest of the board) melting the paste and forming a mechanical connection as well as an electrical connection. The paste is applied to the board by silk screening and then the components are put in place by a pick-and-place machine.

Screen printing is a printing technique whereby a mesh is used to transfer ink onto a substrate, except in areas made impermeable to the ink by a blocking stencil. A blade or squeegee is moved across the screen to fill the open mesh apertures with ink, and a reverse stroke then causes the screen to touch the substrate momentarily along a line of contact. This causes the ink to wet the substrate and be pulled out of the mesh apertures as the screen springs back after the blade has passed.

Basically, it is the process of using a mesh-based stencil to apply ink onto a substrate, whether it be T-shirts, posters, stickers, vinyl, wood, or other material.

Screen printing is also a stencil method of print making in which a design is imposed on a screen of polyester or other fine mesh, with blank areas coated with an impermeable substance. Ink is forced into the mesh openings by the fill blade or squeegee and by wetting the substrate, transferred onto the printing surface during the squeegee stroke.

As the screen rebounds away from the substrate, the ink remains on the substrate. It is also known as silk-screenscreenserigraphy, and serigraph printing. One color is printed at a time, so several screens can be used to produce a multicolored image or design.

SMT (Surface Mount Technology) component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB). They are used for high speed, high precision placing of broad range of electronic components, like capacitors, resistors, integrated circuits onto the PCBs which are in turn used in computers, consumer electronics as well as industrial, medical, automotive, military and telecommunications equipment.



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