/resources/image/template/step.png Footprint SMD

Footprint SMD

Rectangular passive components (mostly resistors and capacitors):

  • 01005 (0402 metric): 0.4 mm × 0.2 mm (0.0157 in × 0.0079 in). Typical power rating for resistors = 0.031 watt
  • 0201 (0603 metric): 0.6 mm × 0.3 mm (0.024 in × 0.012 in). Typical power rating for resistors = 0.05 watt
  • 0402 (1005 metric): 1.0 mm × 0.5 mm (0.039 in × 0.020 in). Typical power rating for resistors = 0.1 or 0.062 watt
  • 0603 (1608 metric): 1.6 mm × 0.8 mm (0.063 in × 0.031 in). Typical power rating for resistors = 0.1 watt
  • 0805 (2012 metric): 2.0 mm × 1.25 mm (0.079 in × 0.049 in). Typical power rating for resistors = 0.125 watt
  • 1008 (2520 metric): 2.5 mm × 2.0 mm (0.098 in × 0.079 in). Typical inductor and ferrite bead package
  • 1206 (3216 metric): 3.2 mm × 1.6 mm (0.126 in × 0.063 in). Typical power rating for resistors = 0.25 watt
  • 1210 (3225 metric): 3.2 mm × 2.5 mm (0.126 in × 0.098 in). Typical power rating for resistors = 0.5 watt
  • 1806 (4516 metric): 4.5 mm × 1.6 mm (0.177 in × 0.063 in)
  • 1812 (4532 metric): 4.5 mm × 3.2 mm (0.18 in × 0.13 in). Typical power rating for resistors = 0.75 watt
  • 2010 (5025 metric): 5.0 mm × 2.5 mm (0.197 in × 0.098 in). Typical power rating for resistors = 0.75 watt
  • 2512 (6332 metric): 6.4 mm × 3.2 mm (0.25 in × 0.13 in). Typical power rating for resistors = 1 watt
  • 2920: 7.4 mm × 5.1 mm (0.29 in × 0.20 in)

Tantalum capacitors length (typ.) x width (typ.) x height (max.):

  • EIA 2012-12 (Kemet R, AVX R): 2.0 mm × 1.3 mm × 1.2 mm
  • EIA 3216-10 (Kemet I, AVX K): 3.2 mm × 1.6 mm × 1.0 mm
  • EIA 3216-12 (Kemet S, AVX S): 3.2 mm × 1.6 mm × 1.2 mm
  • EIA 3216-18 (Kemet A, AVX A): 3.2 mm × 1.6 mm × 1.8 mm
  • EIA 3528-12 (Kemet T, AVX T): 3.5 mm × 2.8 mm × 1.2 mm
  • EIA 3528-21 (Kemet B, AVX B): 3.5 mm × 2.8 mm × 2.1 mm
  • EIA 6032-15 (Kemet U, AVX W): 6.0 mm × 3.2 mm × 1.5 mm
  • EIA 6032-28 (Kemet C, AVX C): 6.0 mm × 3.2 mm × 2.8 mm
  • EIA 7260-38 (Kemet E, AVX V): 7.3 mm × 6.0 mm × 3.8 mm
  • EIA 7343-20 (Kemet V, AVX Y): 7.3 mm × 4.3 mm × 2.0 mm
  • EIA 7343-31 (Kemet D, AVX D): 7.3 mm × 4.3 mm × 3.1 mm
  • EIA 7343-43 (Kemet X, AVX E): 7.3 mm × 4.3 mm × 4.3 mm

Aluminium capacitors:

  • (Panasonic / CDE A, Chemi-Con B): 3.3 mm × 3.3 mm
  • (Panasonic B, Chemi-Con D): 4.3 mm × 4.3 mm
  • (Panasonic C, Chemi-Con E): 5.3 mm × 5.3 mm
  • (Panasonic D, Chemi-Con F): 6.6 mm × 6.6 mm
  • (Panasonic E/F, Chemi-Con H): 8.3 mm × 8.3 mm
  • (Panasonic G, Chemi-Con J): 10.3 mm × 10.3 mm
  • (Chemi-Con K): 13.0 mm × 13.0 mm
  • (Panasonic H): 13.5 mm × 13.5 mm
  • (Panasonic J, Chemi-Con L): 17.0 mm × 17.0 mm
  • (Panasonic K, Chemi-Con M): 19.0 mm × 19.0 mm

SOD: Small Outline Diode

  • SOD-723: 1.4 × 0.6 × 0.59 mm
  • SOD-523 (SC-79): 1.25 × 0.85 × 0.65 mm
  • SOD-323 (SC-90): 1.7 × 1.25 × 0.95 mm
  • SOD-128: 5 × 2.7 × 1.1 mm
  • SOD-123: 3.68 × 1.17 × 1.60 mm
  • SOD-80C: 3.50 × 1.50 × More info

MELF (Metal Electrode Leadless Face): mostly resistors and diodes; barrel shaped components; dimensions do not match those of rectangular references for identical codes.

  • MicroMelf (MMU) Size 0102: length: 2.2 mm, diam.: 1.1 mm. Typical rating for resistors = 0.2 to 0.3 watt / 150 V
  • MiniMelf (MMA) Size 0204: length: 3.6 mm, diam.: :1.4 mm. Typical rating for resistors = 0.25 to 0.4 watt / 200 V
  • Melf (MMB) Size 0207: length: 5.8 mm, diam.: 2.2 mm. Typical rating for resistors = 0.4 to 1 watt / 300 V

DO-214

  • DO-214AA (SMB): 5.30 × 3.60 × 2.25 mm (Dimension include leads)
  • DO-214AB (SMC): 7.95 × 5.90 × 2.25 mm (Dimension include leads)
  • DO-214AC (SMA): 5.20 × 2.60 × 2.15 mm (Dimension include leads)

Three-terminal packages

SOT: Small Outline Transistor, three terminals

  • SOT-223: 6.7 mm × 3.7 mm × 1.8 mm body: four terminals, one of which is a large heat-transfer pad
  • SOT-89: 4.5 mm × 2.5 mm × 1.5 mm body: four terminals, center pin is connected to a large heat-transfer pad
  • SOT-23 (SC-59, TO-236-3): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: three terminals for a transistor
  • SOT-323 (SC-70): 2 mm × 1.25 mm × 0.95 mm body: three terminals
  • SOT-416 (SC-75): 1.6 mm × 0.8 mm × 0.8 mm body: three terminals
  • SOT-663: 1.6 mm × 1.6 mm × 0.55 mm body: three terminals
  • SOT-723: 1.2 mm × 0.8 mm × 0.5 mm body: three terminals: flat lead
  • SOT-883 (SC-101): 1 mm × 0.6 mm × 0.5 mm body: three terminals: leadless

DPAK (TO-252, SOT-428): Discrete Packaging. Comes in three- or five-terminal versions

D2PAK (TO-263, SOT-404): bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions

D3PAK (TO-268): even larger than D2PAK

Five- and six-terminal packages

SOT: small-outline transistor, with more than three terminals

  • SOT-23-5 (SOT-25, SC-74A): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: five terminals
  • SOT-23-6 (SOT-26, SC-74): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: six terminals
  • SOT-23-8 (SOT-28): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: eight terminals
  • SOT-353 (SC-88A): 2 mm × 1.25 mm × 0.95 mm body: five terminals
  • SOT-363 (SC-88, SC-70-6): 2 mm × 1.25 mm × 0.95 mm body: six terminals
  • SOT-563: 1.6 mm × 1.2 mm × 0.6 mm body: six terminals
  • SOT-665: 1.6 mm × 1.6 mm × 0.55 mm body: six terminals
  • SOT-666: 1.6 mm × 1.6 mm × 0.55 mm body: six terminals
  • SOT-886: 1.5 mm × 1.05 mm × 0.5 mm body: six terminals: leadless
  • SOT-886: 1 mm × 1.45 mm × 0.5 mm body: six terminals: leadless
  • SOT-891: 1.05 mm × 1.05 mm × 0.5 mm body: five terminals: leadless
  • SOT-953: 1 mm × 1 mm × 0.5 mm body: five terminals
  • SOT-963: 1 mm × 1 mm × 0.5 mm body: six terminals
  • SOT-1115: 0.9 mm × 1 mm × 0.35 mm body: six terminals: leadless
  • SOT-1202: 1 mm × 1 mm × 0.35 mm body: six terminals: leadless

Packages with more than six terminals

Dual-in-line

  • flatpack was one of the earliest surface-mounted packages.
  • SOIC: (Small-Outline Integrated Circuit), dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm
  • SOJ: Small-Outline Package, J-Leaded, the same as SOIC except J-leaded
  • TSOP: Thin Small-Outline Package, thinner than SOIC with smaller pin spacing of 0.5 mm
  • SSOP: Shrink Small-Outline Package, pin spacing of 0.65 mm, sometimes 0.635 mm or in some cases 0.8 mm
  • TSSOP: Thin Shrink Small-Outline package.
  • QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm
  • VSOP: Very Small Outline Package, even smaller than QSOP; 0.4, 0.5 mm or 0.65 mm pin spacing
  • DFN: Dual Flat No-lead, smaller footprint than leaded equivalent

Quad-in-line

  • PLCC: Plastic Leaded Chip Carrier, square, J-lead, pin spacing 1.27 mm
  • QFP: Quad Flat Package, various sizes, with pins on all four sides
  • LQFP: Low-profile Quad Flat Package, 1.4 mm high, varying sized and pins on all four sides
  • PQFP: Plastic Quad Flat-Pack, a square with pins on all four sides, 44 or more pins
  • CQFP: Ceramic Quad Flat-Pack, similar to PQFP
  • MQFP: Metric Quad Flat Pack, a QFP package with metric pin distribution
  • TQFP: Thin Quad Flat Pack, a thinner version of PQFP
  • QFN: Quad Flat No-lead, smaller footprint than leaded equivalent
  • LCC: Leadless Chip Carrier, contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
  • MLP (MLF): Micro Lead frame Package (Micro Lead-Frame package) with a 0.5 mm contact pitch, no leads (same as QFN)
  • PQFN: Power Quad Flat No-lead, with exposed die-pad[s] for heatsinking

Grid arrays

  • PGA: Pin grid array.
  • BGA: Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm
  • LGA: An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder.
  • FBGA: Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface
  • LFBGA: Low profile Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
  • TFBGA: Thin Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
  • CGA: Column Grid Array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.
  • CCGA: Ceramic Column Grid Array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
  • μBGA: micro-BGA, with ball spacing less than 1 mm
  • LLP: Lead Less Package, a package with metric pin distribution (0.5 mm pitch).

Non-packaged devices (although surface-mount, these devices require specific process for assembly):

  • COB: Chip-On-Board; a bare silicon chip, that is usually an integrated circuit, is supplied without a package (usually a lead frame over molded with epoxy) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
  • COF: Chip-On-Flex; a variation of COB, where a chip is mounted directly to a flex circuit.
  • COG: Chip-On-Glass; a variation of COB, where a chip, typically a Liquid crystal display (LCD) controller, is mounted directly on glass.


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